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TPC 213 is high performance, thermally conductive liquid potting material supplied as a two-component ,room temperature curing system, the material provieds a balance of high thermal conductivity and expansion
 
 


TPC 219 is high performance, thermally conductive liquid potting material supplied as a two-component ,room temperature curing system, the material provieds a balance of high thermal conductivity and expansion

 
 

 

 

¼­¿ï½Ã ±Ýõ±¸ ½ÃÈï3µ¿ 984 ½ÃÈï »ê¾÷ ¿ëÀç ¼¾ÅÍ 12µ¿ 310È£ H) 010-3613-8068